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Multi-layer glass fiber multilayer circuit board quick dismantling technology
Writer:admin    Released:2018-03-30 09:53:21    Type:【L】【M】【S

Because of the glass fiber multilayer circuit board in desoldering Yang of cooling speed is in the process of operation, to spare desoldering caused some difficulties in operation under the condition of: in this paper, we introduce a kind does not have under the condition of professional tools, rapid non-destructive desoldering glass fiber multi-layer circuit boards of various large-scale, components, sockets, socket method.

I. all tools:

Honeycomb coal piece, high temperature adhesive paper, soldering table tempering iron, washing board water, medical needle.

2. Take the computer motherboard BIOS as an example:

1.

On the back of the BIOS seat (the back of the motherboard), use a high temperature adhesive tape to protect it, leaving only the BIOS stand on the back.

Medical needles are mounted on disposable chopsticks.

2.

Fire the honeycomb, and when it is burning, pull it out of the furnace and place it on the ground for a minute or two.

You have to wait for the flame to come down before you can proceed.

3.

The motherboard BIOS seat is located 3 ~ 5 cm above the honeycomb center, and the main plate is continuously moved and evenly heated.

4.

When the solder is melted in 30 seconds or so, use a needle to gently pick out the BIOS seat, and then wash the main plate with the washing board to clean the main plate.

The method of installing new BIOS seat: heating the main board, the soldering tin of the plate on the plate will be melting, and the new BIOS seat will be lined up to be processed by the tin, and it will be heated for 5 seconds to finish the installation.

Pay attention to.

In the above operation, the circuit board must remain above the honeycomb to prevent the circuit board from cooling.

After the soldering is completed, the board should be cooled before washing the board water.

This method is extremely effective for the multiplex circuit board of unsoldering glass fiber. When welding large scale IC, it is better to use the soldering iron to treat the pin as towing.

This method can also deal with the false welding of BGA chip, but first, the BGA pins will be injected with rosin water before heating.

This method of repairing BGA welding has certain risks.

Use caution.

In particular, the method described in this paper is only suitable for glass fiber multilayer circuit board, because it has excellent mechanical strength, high heat dissipation and high temperature resistance.

Ordinary single - time bake lite circuit board can not withstand high temperature, this method can easily cause the circuit board deformation, foaming, burning and other serious damage.

When using this method, it should also pay attention to the heating time, in order to prevent the high temperature from forming the circuit board.

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